随着 5G 通讯技术及新能源汽车的更新换代，对电路板用铜箔提出了更高要求。电解原箔表面经过预处理、粗化、固化、镀锌及镀铬等一系列后处理工艺，才能提高铜箔的组织及性能，满足5G通讯高端电路板的应用。其中，粗化和固化是表面后处理工艺中提高铜箔剥离强度的关键因素。为了避免因尖端放电效应导致粗化表面顶层铜颗粒聚集现象，调控工艺条件和添加剂是细化晶粒、降低表面粗糙度和提高剥离强度的重要途经。本文为了模拟企业生产实际，通过引入阴极辊旋转工艺，探索粗化和固化工艺和添加剂浓度对铜箔后处理微观组织和性能的影响，获得了性能优异的高频电路板用铜箔。

研究内容总结如下：

（1）设计制备了旋转电解铜箔实验装置，引入了线速度变量，研究了粗化工艺参数（线速度、电流密度、沉积时间）和固化工艺参数（电流密度、温度、沉积时间）对铜箔粗化层和固化层微观组织及性能的影响，并探索了粗化和固化结合方式对铜箔微观组织及性能的影响。结果表明，当阴极辊线速度为 60 m/min，粗化电流密度为 25 A/dm²，沉积时间为 22圈时，粗化层“圆球状”颗粒细小致密，铜箔抗剥离强度提高至 0.356 N/mm；当固化电流密度为 30 A/dm²，镀液温度为 42 ℃，沉积时间为 12 圈时，固化得到的铜颗粒均匀沉积在粗化层空隙，在提高剥离强度(0.459 N/mm)的同时也提高了表面粗糙度。此外，对比后处理粗固化结合方式发现，在一次粗化一次固化方式下，铜箔的性能优异。

（2）分别研究了钨酸钠、钨酸钠和硫酸钛复合添加剂以及噻唑啉基二硫代丙烷磺酸钠(SH110)添加剂对铜箔粗化层微观组织及性能的影响。结果表明，SH110 可在溶液中分解出促进剂(MPS)和抑制剂片段(H1)，二者协同使其发挥出与复合添加剂相同的效果。引入 SH110 后，铜箔的粗糙度最低可至 1.76 μm，剥离强度在 SH110 浓度为 40 mg/L时出现明显的提升(0.608 N/mm，提升 70.79%)，细化晶粒效果较钨酸钠和硫酸钛复合添加剂而言更优异，且单组元添加剂的浓度较二元添加剂更易调控。

（3）优化了铜箔光面镀锌和镀铬工艺条件，分析了镀锌和镀铬工艺参数（电流密度、沉积时间、镀液温度）对铜箔光面锌阻挡层和铬钝化层微观组织及抗氧化、耐腐蚀性能的影响。结果表明，当镀锌电流密度为 2 A/dm²，沉积时间为 16 圈，镀液温度为 40 ℃时，镀锌层的微观形貌致密，耐腐蚀性能最佳；当镀铬电流密度为 1 A/dm²，沉积时间为 15圈，镀液温度为 30 ℃时，铬钝化层性能优异。

With the upgrading of 5G communication technology and new energy vehicles, higher requirements have been placed on copper foils for circuit boards. The surface of electrolytic raw foil undergoes a series of post-treatment processes, such as pre-treatment, roughening, curing, zinc-plating and chrome-plating, in order to improve the microstructure and performance of copper foil and meet the application of high-end circuit boards for 5G communication. Among them, roughening and curing are the key factors to improve the peel strength of copper foil in the surface post-treatment process. In order to avoid the aggregation of copper particles on the top layer of the roughened surface due to the tip discharge effect, the regulation of process conditions and additives is an important way to refine the grains, reduce the surface roughness and improve the peeling strength. In this paper, on the basis of simulating the actual production, by introducing cathode roll rotation, we explored the effects of roughing and curing process and additive concentration on the microstructure and properties of copper foil post-treatment, and obtained copper foils with excellent performance for high-frequency circuit boards. The research findings are summarized as follows:

(1) The experimental setup was optimized, the linear speed variable was introduced, and the effects of the roughening process parameters (linear speed, current density, deposition time) and the curing process parameters (current density, temperature, deposition time) on the microstructures and properties of the roughened and cured layers of the copper foils were investigated, as well as the effects of the combination of the roughening and curing methods on the microstructures and properties of the copper foils were explored. The results show that when the cathode roller line speed is 60 m/min, the roughening current density is 25 A/dm², and the deposition time is 22 turns, the roughened layer has fine and dense "orb-like" particles, and the peel strength of the copper foil is increased to 0.356 N/mm; and when the curing current density is 30 A/dm², the plating solution temperature is 42℃, the deposition time is 12 turns, and the curing current density is 30 A/dm², the plating solution temperature is 42℃, and the deposition time is 12 turns, and the curing current density is 30 A/dm2 . When the curing current density is 30 A/dm², the plating solution temperature is 42°C, and the deposition time is 12 turns, the copper particles obtained from curing are uniformly deposited in the voids of the roughened layer, which improves the peeling strength (0.459 N/mm) as well as the surface roughness. In addition, a comparison of the combination of post-treatment roughening and curing methods revealed that the copper foils had excellent properties under the one roughening and one curing method.

(2) The effects of sodium tungstate, sodium tungstate and titanium sulphate composite additives and sodium thiazolidinedithiopropane sulfonate (SH110) additive on the microstructure and properties of the roughened layer of copper foils were investigated respectively. The results showed that SH110 could decompose the promoter (MPS) and inhibitor fragment (H1) in solution, and the synergistic effect of the two made it exert the same effect as the composite additive. After the introduction of SH110, the roughness of copper foils could be as low as 1.76 μm, and the peel strength also showed a significant increase (0.608 N/mm, 70.79% increase) at the concentration of SH110 of 40 mg/L. The effect of grain refining was more superior than that of sodium tungstate and titanium sulphate composite additives, and the concentration of the single-component additives was more easily adjustable than that of the binary additives.

(3) The process conditions of zinc plating and chromium plating on the bright surface of copper foil were optimized, and the effects of zinc plating and chromium plating process parameters (current density, deposition time, and plating solution temperature) on the microstructure and the antioxidant and corrosion-resistant properties of the bright surface zinc barrier and chromium passivation layer of copper foil were investigated. The results show that the microstructure of zinc plating layer is dense and the corrosion resistance is best when the current density of zinc plating is 2 A/dm², the deposition time is 16 turns, and the temperature of plating solution is 40°C. The performance of chromium passivation layer is excellent when the current density of chromium plating is 1 A/dm², the deposition time is 15 turns, and the temperature of plating solution is 30°C.