近年来，环氧树脂在紫外光3D打印固化耗材领域有众多应用成果，但由于自身存在交联密度高、固化后内应力大、脆性大、不耐冲击和耐热性能差等缺点，使其较难满足立体光固化成型技术（SLA）打印的应用要求。因此，对环氧树脂进行增韧补强，提高力学性能、耐热性能的改性研究具有重要意义。基于此，本论文选用常用的双酚A型环氧丙烯酸酯为基体，采用化学接枝和无机填料对树脂进行进一步改性，深入研究改性后环氧树脂的耐热性能、力学性能和微观形貌等。

首先通过研究稀释剂种类和含量、光引发剂含量、预聚物与稀释剂质量比对光敏树脂材料性能的影响，制备出了一种低黏度、低固化收缩率的SLA用3D打印光敏树脂，树脂黏度为222.2 mPa·s、固化收缩率为6.28%，符合SLA-3D打印要求。

选用异佛尔酮二异氰酸酯（IPDI）、羟基硅油和丙烯酸羟乙酯（HEA）为原料，制备了一种有机硅中间产物，采用化学接枝的方法将-Si-O-基团引入环氧树脂的侧链，实现了对环氧树脂的有机硅改性，系统研究了有机硅改性对环氧树脂力学性能、耐热性和微观形貌等方面的影响。结果表明，有机硅改性能明显降低树脂的固化收缩率，提高打印精度。另外，材料的力学性能显著提升，冲击强度和断裂伸长率分别提高了32.8%和8.65%，由脆性断裂转为韧性断裂，但材料的拉伸强度有所下降。改性后树脂的玻璃转化温度提高了8.46℃，T_50%和T_max分别提高了1.9℃和6℃，表明经有机硅改性后环氧树脂的耐热性能得到了提高。

选用硅烷偶联剂γ-甲基丙烯酰氧基丙基三甲氧基硅烷（KH-570）对纳米TiO₂进行表面有机改性，并将改性后的二氧化钛对有机硅/环氧树脂进行改性，研究了不同添加量对有机硅光敏树脂材料力学性能和耐热性能的影响。结果表明，当KH-570含量20wt%时，表面改性二氧化钛分散性更好，团聚现象减少。当二氧化钛的添加量为1.5wt%时，光敏树脂的力学性能较优，拉伸强度、冲击强度和断裂伸长率较有机硅改性树脂分别提高了51.1%、43.8%和10.8%，硬度值保持在81-83 HD。T_50%、T_max和残炭率分别比有机硅改性环氧树脂的提高了1.44℃、1.34℃和23.8%，玻璃转化温度（T_g）在纳米TiO₂添加量为2.5wt%时达到最大值，比纯环氧树脂和有机硅改性树脂分别提高了14.08℃和10.62℃，热稳定性能得到显著改善。

Epoxy resin has been widely used in the field of UV 3D printing curing consumables in recent years, but it is difficult to meet the application requirements of SLA (Stereo Lithography Appearance) 3D printing due to its shortcomings, such as high cross-linking density, high internal stress after curing, brittle quality, poor impact resistance and thermal stability. Therefore, it is great significance to toughen and strengthen the epoxy resin to improve its mechanical properties and heat resistance. In this paper, the commonly used bisphenol A type epoxy acrylate as the matrix, using organic and inorganic fillers to further modify the resin, in-depth study of the modified epoxy resin thermal stability mechanical properties and microscopic morphology.

Firstly, the effects of diluent type and content, photoinitiator content and mass ratio of prepolymer to diluent on the properties of photosensitive resin materials were studied. A photosensitive resin with low viscosity and low curing shrinkage for SLA was prepared. The resin viscosity was 222.2 mPa·s and the curing shrinkage was 6.28%, which met the requirements of SLA-3D printing.

An organosilicone intermediate was prepared by using isophorone diisocyanate (IPDI), hydroxy silicone oil and hydroxyethyl acrylate (HEA) as raw materials. The silicone modification of epoxy resin was realized by introducing -Si-O- group into the side chain of epoxy resin by chemical grafting method. The effects of organosilicon modification on mechanical properties, thermal stability and microstructure of epoxy resin were systematically studied. The results showed that the curing shrinkage of epoxy resin modified by organosilicon were obviously reduced and the printing precision were improved. In addition, the mechanical properties of the material was significantly improved, the impact strength and elongation at break were increased by 32.8% and 8.65% respectively, and the brittle fracture was transformed 

into ductile fracture, but the tensile strength of the material was decreased. The glass conversion temperature of modified epoxy resin was increased by 8.46℃, T_50% and T_max were increased by 1.9℃ and 6℃, respectively, indicating that the thermal stability of modified epoxy resin can be improved by organosilicate.

A silane coupling agent γ-methylacrylloxy propyl trimethoxy silane (KH-570) was used to modify the surface of nano-sized TiO₂, and the modified TiO₂ was composite modified with epoxy resin modified by organosilicone. The effects of different addition amounts on the properties of organosilicone photosensitive resin materials were studied. The results showed that when the content of KH-570 reached 20%, which the dispersion of surface modified TiO₂ was better, and the agglomeration phenomenon was obviously reduced. The tensile strength, impact strength and elongation at break were increased by 51.1%, 43.8% and 10.8%, respectively, compared with the silicone modified resin when the addition amount of titanium dioxide in the system was 1.5%, and the hardness value was maintained at 81-83 HD. The thermal stability was also improved, T_50%, T_max and carbon residue rate were increased by 1.44℃, 1.34℃ and 23.8%, respectively, compared with the silicone modified epoxy resin. The glass conversion temperature reached the maximum value when the addition amount was 2.5%, which was increased by 14.08℃ and 10.62℃, respectively, compared with the pure epoxy resin and the silicone modified resin.

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