随着高性能计算、人工智能、5G通信和云计算的快速发展对高速数据传输和处理需求的日益增长，高密度化和高集成化带来的散热问题成为当务之急。目前高速有机基板的导热系数在0.3-0.4 W/m·K之间，严重影响了信号传输的稳定性，为了确保信号传输的完整性和可靠性，覆铜板作为基础材料需要具备较低的介电性能，同时还需要具备较高的导热性能以满足基板的散热需求。因此，提高高速覆铜板的导热系数成为目前高速覆铜板研究热点，这就涉及了实现填料高充填量以及导热性与介电性平衡的技术难题。本文通过低介电硅微粉填料和高导热Al₂O₃填料进行复配填充，探究环氧树脂在填料高填充量下的成膜性问题以及如何有效实现低介电性与高导热性，制备出高导热低介电性的高速覆铜板。此外，还进一步研究了热处理对高速覆铜板性能的综合影响。

（1）在填料高填充量下，通过原子力显微镜（AFM）测定带胶铜箔（RCC）的表面粗糙度以及表面形貌，研究基体树脂、填料等对RCC成膜性的影响。实验发现，树脂的分子量分布越宽其成膜性越好，其次大小分子链段相互交错以及柔性链段的加入也有利于成膜性能的提升；其次，采用球形填料制备RCC时有着更好的成膜性，当填料含量超过80 wt%后成膜性能会急剧变差，进而严重影响覆铜板的各项性能。除此之外，选择离型力为100 g/mm的离型膜作为涂膜基材所制备的RCC的成膜效果最好。

（2）在填料高填充量下的RCC成膜性的研究基础上，进一步制备高速覆铜板。通过对导热性、介电性以及击穿电压等性能测试，研究了Al₂O₃添加量、粒径的配比等对覆铜板性能的影响，确定覆铜板最佳研究配方。实验得出：当填料总填充量为80 wt%，Al₂O₃的含量为填料总量的20%，其中Al₂O₃（5 μm）: Al₂O₃（10 μm）=1:1时，制备的覆铜板导热率为1.39 W/m·K，在10 GHz下介电常数（D_k）为3.61，介电损耗（D_f）为0.01，击穿电压为7.02 kV/100 μm，剥离强度为1.12 N/mm，覆铜板的各项性能优异。

（3）通过凝胶化时间、非等温DSC、溢胶量和剥离强度的测试，确定高速覆铜板的最佳固化压制工艺为：100 ℃ × 30 min × 0.1 MPa + 140 ℃ × 30 min × 0.4 MPa + 160 ℃ × 30 min × 0.4 MPa + 180 ℃ × 1 h × 0.4 MPa + 200 ℃ × 30 min × 0.4 MPa。除此之外，研制的高速覆铜板应用在高密度互连基板上，最低剥离强度达到6.4101 lb/inch（1.12 N/mm），镭射后上/下孔径比>90%，电镀后，无盲孔底部裂纹等品质异常，可靠性测试满足IPC3及标准测试。

（4）基于实际应用情况，高速覆铜板热处理后，通过导热性能、击穿电压等性能测试，探究热处理对覆铜板各项性能的影响。由实验可知，热处理提供了一定的能量，填料粒子与树脂之间存在浓度差，发生一定程度的扩散，填料与树脂界面结合增强，绝缘层更加致密，进而覆铜板的导热性能、击穿电压以及硬度逐渐增大，吸水率降低。其次，在相同时间下，温度越高时，所提供的能量越高，覆铜板各项性能变化越明显，但当温度高于220 ℃后，铜箔发生氧化发黑现象进而影响覆铜板的实际应用。此外，随着填料含量的增多，填料与树脂的浓度差越明显，热处理对覆铜板的各项性能的影响越显著，然而当填料含量超过80 wt%后，热处理后的覆铜板剥离强度降低。在200 ℃下热处理16天后，高速覆铜板的导热系数从1.39 W/m·K提升至1.67 W/m·K，提高了20%；击穿电压从7.02 kV提升至9.01 kV，提升了28%，吸水率降低了95%；热分解温度提高了5.5 ℃，热膨胀系数降低了12.3%，拉伸强度增长了15.5%。

With the rapid advancement of high-performance computing, artificial intelligence, 5G communication, and cloud computing, there is an increasing demand for high-speed data transmission and processing. Consequently, the heat dissipation issue resulting from high densification and integration has become a top priority. Currently, the thermal conductivity of high-speed organic substrates ranges between 0.3-0.4 W/m·K, significantly impacting signal transmission stability. To ensure the integrity and reliability of signal transmission, copper-clad laminates used as base materials must possess low dielectric properties while maintaining high thermal conductivity. Therefore, it is urgent and necessary to develop copper-clad laminates with both low dielectricity and high thermal conductivity for high-speed applications. In this study, we prepare a copper-clad laminate with excellent thermal conductivity and low dielectricity by compounding silica micropowder filler with low dielectric properties along with Al₂O₃ filler possessing superior thermal conductivity. We investigate the film-forming performance of epoxy resin under higher filling amounts of these fillers to effectively achieve desired characteristics of low dielectricity and high thermal conductivity. Furthermore, considering practical applications in mind, we conduct comprehensive investigations on how heat treatment influences the performance of copper-clad laminates.

(1) The surface roughness and surface morphology of resin-coated copper (RCC) were determined by Atomic Force Microscopy (AFM) at high filler content to investigate the effects of matrix resin, filler and film-forming substrate on the film-forming property of RCC. It was found that the wider the molecular weight distribution of the resin, the better the film-forming property, and the interlocking of large and small molecular chain segments is also conducive to the enhancement of film-forming property; secondly, the spherical filler has a better film-forming property, and the film-forming property will deteriorate drastically when the content of the filler is more than 80 wt%, which will then seriously affect the properties of the copper-clad laminate. In addition, the film-forming effect of RCC prepared by selecting the release film with moderate release force as the film-forming substrate is the best. In addition, the development of high-speed copper-clad laminates used in high-density interconnect substrates ensures a minimum peel strength of 6.4101 lb/inch (1.12 N/mm), atop/bottom aperture ratio greater than 90%, and no quality anomalies such as cracks or blind holes at the bottom after plating, thus meeting the reliability requirements of IPC3 and standard tests.

(2) The high-speed copper-clad laminates were further prepared based on the investigation of RCC film formation at high filler content in order to determine the optimal formulation. Thermal conductivity, dielectricity, and breakdown voltage were subjected to testing, while the effects of Al₂O₃ additions and particle size ratio on the performance of copper-clad laminates were examined. Experimentally, the thermal conductivity of the prepared copper-clad laminates was measured as 1.39 W/m·K with a total filler content of 80 wt% (comprising 80% SiO₂ and 20% Al₂O₃), along with an Al₂O₃(5 μm) to Al₂O₃(10 μm) ratio of 1:1. The dielectric constant (D_k) was determined as 3.61 at a frequency of 10 GHz, whereas the dielectric loss (D_f) was 0.01. Additionally, the breakdown voltage was established as 7.02 kV/100 μm, and peel strength reached a value of 1.12 N/mm indicating exceptional performance for these copper-clad laminates.

(3) Through the test of gelation time, non-isothermal DSC, overflow and peel strength, the optimal curing and pressing process is determined as follows: 100 ℃ × 30 min × 0.1 MPa + 140 ℃ × 30 min × 0.4 MPa+160 ℃ × 30 min × 0.4 MPa + 180 ℃ × 1 h × 0.4 MPa + 200 ℃ × 30 min × 0.4 MPa. In addition, the developed high-speed copper clad plate is applied to high-density interconnect substrate, the minimum peel strength reaches 6.4101 lb/inch (1.12N /mm), the upper/lower aperture ratio after laser is >90%, after electroplating, no blind hole bottom cracks and other quality abnormalities, reliability test meets IPC3 and standard tests.

(4) Based on practical applications, this study conducts heat treatment on the prepared high-speed copper-clad laminates and investigates the impact of heat treatment on various properties such as thermal conductivity, breakdown voltage, and other performance tests. The results demonstrate a disparity in concentration between filler particles and resin. Heat treatment introduces a certain amount of energy that promotes diffusion with increasing treatment time, thereby enhancing the interfacial bonding between filler and resin, densifying the insulating layer, gradually improving the thermal conductivity, breakdown voltage, and hardness of copper-clad laminates while reducing water absorption rate. Furthermore, higher temperatures provide more energy leading to more significant changes in laminate performance. Additionally, as filler content increases, there is an amplified difference in concentration between filler and resin resulting in a more pronounced effect of heat treatment on laminate properties. After being heat treated at 200 ℃ for 16 days, the thermal conductivity of the high-speed copper-clad laminate improved from 1.39 W/m·K to 1.67 W/m·K, representing a 20% increase. Additionally, the breakdown voltage increased from 7.02 kV to 9.01 kV, showing a growth of 28%. Moreover, the water absorption rate decreased by 95%, while the thermal decomposition temperature increased by 5.5 ℃ and the coefficient of thermal expansion reduced by 12.3%. Furthermore, there was a significant improvement in tensile strength with an increase of 15.5%.