在众多的打印技术中，光固化快速成型（SLA）以其独特的精确性和低能耗性成为目前最为成熟的成型技术。但目前的光敏树脂其性能单一，不具有特定的热，光，电，磁等特性，严重限制了其在信息产业及新能源等众多新兴产业中的应用。因此，需研发具备高精度打印能力、快速光固化特性、力学性能出色以及具有功能性的光敏树脂原料，这对于立体光刻（SLA）三维打印技术的进步具有至关重要的意义。

（1）选用双酚A环氧二丙烯酸酯（2-EA）和脂肪族三官能度聚氨酯丙烯酸酯（3-PUA）作为双组分丙烯酸酯低聚物，1,6-己二醇二丙烯酸酯（HDDA）为稀释单体，2,4,6-三甲基苯甲酰基-二苯基氧化膦（TPO）为光引发剂制备双组分丙烯酸酯光敏树脂。当2-EA、3-PUA、HDDA和TPO的最佳质量比为25.3: 38: 31.7: 5时树脂的性能最优，黏度为386 mPa·s，拉伸强度和断裂伸长率分别为30.85 MPa和14.82%，冲击强度为7.01 kJ/m²。

（2）选用天然鳞片石墨、五氧化二磷（P₂O₅）、过硫酸钾（K₂S₂O₈）和高锰酸钾（KMnO₄）为原料，通过改良的Hummers法制备了氧化石墨烯（GO）并对比了硅烷偶联剂KH550、KH560和KH570分别对GO的改性效果，结果表明KH570对GO的改性效果良好，提高了其在光敏树脂中的分散性。将KH570改性的GO（FGO）与光敏树脂进行机械共混，探究不同含量的FGO对3D打印成型件性能的影响。结果表明当FGO的添加量为0.6 wt%时，光敏树脂复合材料的光固化速度有所降低，但成型件的力学性能优良，固化收缩率为5.22%，拉伸强度和断裂伸长率分别为40.35 MPa和16.71%，冲击性能为10 kJ/m²，硬度为84 HD。在600 ℃时，0.6 wt% FGO改性的光敏树脂复合材料比纯树脂材料的质量残留率高了25%，热失重所对应的温度T_10%、T_50%和T_max分别提高了76.22、5.31和5 ℃。当FGO的含量为0.6 wt%时，改性树脂的玻璃化转变温度比纯树脂提高了8 ℃。

（3）采用高温热解炭化工艺，以Fe(NO₃)₃·9H₂O、乙二醇和NaOH为主要原料，可溶性淀粉为前驱体，成功合成了碳包覆铁（Fe@C）纳米颗粒，结果表明在900 ℃热解炭化温度下、保温时间为8 h，所制备的Fe@C的性能达到最优。为改善Fe@C纳米颗粒在树脂中的分散性，选用硅烷偶联剂KH570对Fe@C纳米颗粒进行表面改性，当KH570的含量为12%时，Fe@C纳米粒子在树脂中的分散性良好，团聚现象有明显改善。测试发现KH570改性后的Fe@C纳米粒子的紫外吸收特征峰与SLA 3D打印机发射波长更加匹配，提升了打印树脂的光固化速度。接着，通过机械混合的方式，将已改性的纳米Fe@C与光敏树脂相结合，得到一种性能更为出色的改性光敏树脂。结果显示当Fe@C颗粒的添加量相同时，200目筛网下Fe@C改性的光敏树脂比300目筛网下Fe@C改性的光敏树脂性能更加优异。当200目筛网下的Fe@C的添加量为0.8 wt%时，光敏树脂复合材料的拉伸强度和断裂伸长率比改性前树脂分别提高了37.54%和47.91%，冲击强度为最大值15.60 kJ/m²。此时，改性树脂的饱和磁化强度为0.20 emu/g，说明Fe@C颗粒的加入可以赋予树脂一定的磁性能。从热失重数据看出，改性后的光敏树脂材料在T_10%、T_50%和T_max所对应的温度分别提高了188.19、37.73和35.89 ℃，在600 ℃时改性光敏树脂材料的残留质量率为11.56%，比未改性树脂提高了47.26%。

Among the many printing technologies, light-curing rapid prototyping (SLA) has become the most mature molding technology with its unique accuracy and low energy consumption. However, the current photosensitive resin has a single property, does not have specific thermal, optical, electrical, magnetic and other characteristics, which seriously limits its application in the information industry and new energy and many other emerging industries. Therefore, it is necessary to develop photosensitive resin raw materials with high-precision printing capability, fast light-curing properties, excellent mechanical properties and functionality, which is of vital significance to the progress of stereolithography (SLA) three-dimensional printing technology.

(1) Bisphenol A epoxy diacrylate (2-EA) and aliphatic trifunctional urethane acrylate (3-PUA) were selected as the two-component acrylate oligomers, 1,6-hexanediol diacrylate (HDDA) as the diluent monomer, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO) as the photoinitiator for the preparation of the two-component acrylate photosensitive resin. The resin showed optimal properties when the optimal mass ratio of 2-EA, 3-PUA, HDDA and TPO was 25.3: 38: 31.7: 5. The viscosity was 386 mPa·s, the tensile strength and elongation at break were 30.85 MPa and 14.82%, respectively, and the impact strength was 7.01 kJ/m².

(2) Natural flake graphite, phosphorus pentoxide (P₂O₅), potassium persulfate (K₂S₂O₈) and potassium permanganate (KMnO₄) were selected as raw materials, and graphene oxide (GO) was prepared by the modified Hummers' method and compared with the modification effects of silane coupling agents KH550, KH560 and KH570 on GO, respectively. The results showed that KH570 modified GO well and improved its dispersion in photosensitive resin. KH570-modified GO (FGO) was mechanically blended with photosensitive resin to investigate the effect of different contents of FGO on the properties of 3D printed molded parts. The results showed that when the addition amount of FGO was 0.6 wt%, the molded parts had excellent mechanical properties, with a curing shrinkage of 5.22%, tensile strength and elongation at break of 40.35 MPa and 16.71%, respectively, an impact property of 10 kJ/m², and a hardness of 84 HD. At 600 °C, the 0.6 wt% FGO-modified photosensitive resin composites showed a 25% higher mass residual than the pure resin material, and the temperatures corresponding to the thermal weight loss, T_10%, T_50%, and T_max, were increased by 76.22, 5.31, and 5 °C, respectively. When the content of FGO was 0.6 wt%, the glass transition temperature of the modified resin was increased by 8 °C compared with that of the pure resin.

(3) Carbon-coated iron (Fe@C) nanoparticles were successfully synthesized by a high-temperature pyrolytic carbonization process using Fe(NO₃)₃·9H₂O, ethylene glycol, and NaOH as the main raw materials, and soluble starch as the precursor. The results showed that the properties of the prepared Fe@C reached the optimum at a pyrolytic carbonization temperature of 900 ℃ and a holding time of 8 h. The results of this study were summarized as follows. In order to improve the dispersion of Fe@C nanoparticles in the resin, silane coupling agent KH570 was selected for surface modification of Fe@C nanoparticles, and the dispersion of Fe@C nanoparticles in the resin was good, and the agglomeration phenomenon was significantly improved when the content of KH570 was 12%. Tests found that the UV absorption characteristic peaks of the KH570-modified Fe@C nanoparticles better matched the emission wavelengths of SLA 3D printers, enhancing the light-curing speed of the printing resin. Then, the modified nano-Fe@C was combined with the photosensitive resin by mechanical mixing to obtain a modified photosensitive resin with more excellent performance. The results show that when the addition amount of Fe@C particles is the same, the Fe@C-modified photosensitive resin under 200 mesh screen has more excellent performance than the Fe@C-modified photosensitive resin under 300 mesh screen. When the addition amount of Fe@C under 200 mesh sieve is 0.8 wt%, the tensile strength and elongation at break of the photosensitive resin composites were increased by 37.54% and 47.91%, respectively, over the pre-modified resin, and the impact strength was the maximum value of 15.60 kJ/m². At this time, the saturation magnetization strength of the modified resin was 0.20 emu/g, indicating that the addition of Fe@C particles can confer certain magnetic properties to the resin. From the heat loss of weight data, it is seen that the temperatures corresponding to T_10%, T_50% and T_max of the modified photosensitive resin material have been increased by 188.19, 37.73 and 35.89 ℃, respectively, and the residual mass rate of the modified photosensitive resin material at 600 ℃ is 11.56%, which is 47.26% higher than that of the unmodified resin.